芯原股份加入UCIe产业联盟开启芯片排名前十的传奇征程

雷峰网(公众号:雷峰网)消息,中国芯片设计平台即服务企业芯原股份在本周六宣布加入了UCIe产业联盟,这一举措被视为开启中国芯片排名前十的传奇征程。作为中国首个加入该产业联盟的企业,芯原股份将与其他成员共同致力于UCIe1.0版本规范和新一代UCIe技术标准研究与应用,以推动其Chiplet产品发展。

UCIe产业联盟成立初期,由全球知名芯片制造商英特尔、台积电、三星联手芯片封测龙头日月光,以及AMD、Arm、高通、谷歌、微软、Meta等科技行业巨头共同推出,是一个全新的通用芯片互连标准。这一标准旨在为小型化的晶体管互连制定一个新的开放标准,简化相关流程,并提高来自不同制造商的小型化晶体管之间的互操作性。该标准下,晶体管制造商可以在合适的情况下混合构建晶体管。

随着国际关系紧张背景下的新技术发展,一些观点认为UCIe标准对国内产业价值模糊,但也有声音认为UCIe是一个推动Chiplet生态发展的重要标志,是整个半导体产业链合作愈发紧密的迹象。业内人士表示:“建立标准的意义就在于建立生态系统,参与成员越多越好。”

对于是否需要做自己的Chiplet标准,有不同的看法。一位业内人士提到:“既然有开放的协议,就应该用开放的协议。”而戴伟民创始人、董事长兼总裁则明确指出,“中国要不要做自己的Chiplet标准,不会永远只和中国的芯片互连。”

现在,与此同时,随着China's semiconductor industry continues to evolve, it is becoming increasingly clear that Chiplets will play a major role in the future of computing and beyond. As noted by Mr. Dai Wei-min, founder, chairman and CEO of Xianxin Semiconductor Co., Ltd., "The use of chiplets will revolutionize the way we design and manufacture semiconductors."

This new approach to semiconductor manufacturing has been hailed as a game-changer for the industry, as it allows for greater flexibility and customization in the design process. By breaking down complex systems into smaller building blocks or chiplets, manufacturers can create more efficient and cost-effective designs.

As China's chipmaking industry continues to grow at an incredible pace, it is clear that Chiplets will be a key part of this growth story. With companies like Xianxin Semiconductor Co., Ltd leading the charge towards this new era in semiconductor manufacturing, there is no doubt that China will continue to play a major role in shaping the future of computing and beyond.

In conclusion, with its recent joining of UCIe Industries Alliance , Xianxin Semiconductor Co., Ltd has made history by becoming one step closer to realizing this vision for a more connected world through its innovative use of Chiplets technology.

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